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Encapsulation


Epoxy encapsulation addresses such electronic component environmental concerns as shock/vibration, moisture and humidity and high voltage breakdown. TEAM operates several programmable encapsulation vacuum ovens to degas the encapsulating epoxy while providing the proper curing cycle.
 






 

Encapsulation includes:
  • CTBN (electronic assemblies, Fireset components)
  • ALOX (MFG, standoffs)
  • RTV 630 (electronic assemblies, molds)
  • HYSOL (electronic assemblies)